1 mlo tm hi-q inductors applications ? mobile communications ? satellite applications ? gps ? collision avoidance ? wireless lans features ? high q ? high srf ? high frequency ? low dc resistance ? surface mountable ? 0402 case size ? rohs compliant finishes ? available in tape and reel surface mount advantages ? inherent low profile ? excellent solderability ? low parasitics ? better heat dissipation ? expansion matched to pcb dimensions quality inspection finished parts are 100% tested for electrical parameters and visual characteristics. termination rohs compliant sn finish. operating temperature -55oc to +125oc mm (inches) lwtr 1.000.10 0.580.075 0.350.10 0.1250.050 (0.0400.004) (0.0230.003) (0.0140.004) (0.0050.002) w l r t hlq type hlq = high q 02 size 02 = 0402 x tolerance b = 0.1nh c = 0.2nh h = 3% t termination sn100 tr packaging tape & reel how to order xxx inductance expressed in nh (2 significant digits + number of zeros) for values <10nh, letter r denotes decimal point. example: 22nh = 220 4.7nh = 4r7 the multilayer organic hi-q inductor is a low profile organic based inductor that can support mobile communications, satellite applications, gps, matching networks, and collision avoidance. the mlo tm hi-q inductor series of components are based on avxs patented multilayer organic technology (us patent 6,987,307 and 7,439,840). mlo tm hi-q inductors incorporate very low loss organic materials and low profile copper which allow for high q and high stability over frequency. mlo tm hi- q inductors are surface mountable and are expansion matched to fr4 printed wiring boards. mlo tm hi-q inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. reliability testing is performed to jedec and mil standards. finishes are available in rohs compliant sn.
2 mlo tm hi-q inductors 0402 electrical specifications available l (nh) inductance tolerance q min srf min rdc max idc max 450mhz b = 0.1nh, c = 0.2nh 450mhz (ghz) (m) (ma) h = 3% 0.8 0.1nh, 0.2nh 17 7 100 350 0.9 0.1nh, 0.2nh 17 7 100 350 1 0.1nh, 0.2nh 17 7 100 330 1.1 0.1nh, 0.2nh 17 7 100 330 1.2 0.1nh, 0.2nh 17 7 110 330 1.3 0.1nh, 0.2nh 17 7 130 330 1.5 0.1nh, 0.2nh 17 7 150 330 1.6 0.1nh, 0.2nh 17 7 150 300 1.8 0.1nh, 0.2nh 17 7 160 300 2 0.1nh, 0.2nh 17 7 180 245 2.2 0.1nh, 0.2nh 17 7 200 245 2.4 0.1nh, 0.2nh 17 7 200 245 2.7 0.1nh, 0.2nh 17 7 250 245 3 0.1nh, 0.2nh 17 7 300 225 3.3 0.1nh, 0.2nh 17 7 340 225 3.6 0.1nh, 0.2nh 17 7 350 200 3.9 0.1nh, 0.2nh 17 7 400 200 4.7 0.1nh, 0.2nh 17 7 480 195 5.6 0.1nh, 0.2nh 17 7 500 170 6.8 3% 17 7 600 160 8.2 3% 17 6 800 130 10 3% 17 5 1000 120 12 3% 17 4 1100 110 15 3% 17 4 1200 110 18 3% 17 3 1500 110 22 3% 17 3 1900 95 27 3% 17 3 2100 95 30 3% 17 2 2200 85 32 3% 17 2 2200 85 specifications based on performance of component assembled properly on printed circuit board with 50 nominal impedance. idc max: maximum 15oc rise in component temperature over ambient.
|
